Robust Growth Forecasted for Electronics Adhesives Market: CAGR of 9.0% Anticipated, Targeting US$ 12.1 Billion by 2033
The global Electronics Adhesives Market is anticipated to reach a valuation of US$ 5.1 billion in 2023, driven by rising smart home technological advancements. The trend is expected to create new opportunities for the market, leading to a projected CAGR of 9.0% between 2023 and 2033, and reaching a total valuation of approximately US$ 12.1 billion by 2033.
One of
the primary factors driving the growth of the electronics adhesives market is
the rapid advancement and innovation in electronic devices. The demand for
smaller, lighter, and more compact electronic products has increased
significantly, leading to the need for adhesive materials that can provide
strong and reliable bonding in miniature applications. Electronics adhesives,
with the trend of miniaturization, play a crucial role in ensuring the secure
attachment of components, enabling the seamless integration of complex
electronic systems.
Another
significant factor contributing to market growth is the increasing complexity
of electronic device designs. The need for adhesives that can bond diverse
materials and substrates has intensified, as electronic devices become more
sophisticated and multifunctional. Adhesive solutions with compatibility across
various surfaces, such as metals, plastics, ceramics, and glass, are in high
demand. Manufacturers require adhesives that offer excellent adhesion strength,
thermal stability, and resistance to environmental factors like moisture,
temperature variations, and chemicals.
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The rise
of emerging technologies is also anticipated to escalate the growth of the
electronics adhesives market. Technologies such as 5G, Internet of Things
(IoT), artificial intelligence (AI), and virtual reality (VR) are creating new
opportunities in the electronics industry. The technologies demand reliable and
durable adhesive solutions for applications ranging from high-speed
communication systems to advanced sensor devices. Electronics adhesives play a
vital role in ensuring the performance, durability, and reliability of these
advanced electronic systems.
The
increasing focus on sustainability and environmental regulations is influencing
the electronics adhesives market. Manufacturers are seeking adhesive solutions
that are environmentally friendly, low in volatile organic compounds (VOCs),
and comply with stringent regulations. The development of eco-friendly
adhesives that offer comparable performance to traditional counterparts is
becoming a key focus area, driving the demand for sustainable adhesive
solutions.
The
semiconductor industry is experiencing rapid growth and technological
advancements. The transition towards advanced packaging technologies such as
system-in-package (SiP), fan-out wafer-level packaging (FOWLP), and 3D
packaging requires innovative adhesive solutions to ensure reliable connections
and thermal management. Electronics adhesives play a critical role in bonding
and protecting semiconductor devices, driving the demand for specialized
adhesive formulations.
Key
Takeaways from the Market Study
- Global electronics adhesives
market was valued at US$ 4.7 billion by 2022-end.
- From 2018 to 2022, the
market demand expanded at a CAGR of 6.5%.
- China is expected to hold a
dominant CAGR of 8.5% during the forecast period.
- By Material Type, the
Polyurethane segment is expected to constitute a CAGR of 8.5% in 2033.
- On the basis of End-Use, the
automotive sector segment is expected to dominate the market with a CAGR
of 8.6% in 2033.
- From 2023 to 2033,
electronics adhesives market is expected to flourish at a CAGR of 9.0%.
- By 2033, the market value of
electronics adhesives is expected to reach US$ 12.1 billion.
Technological
advancements in adhesive formulations, across the globe is a major factor that
is expected to propel the growth of the electronics adhesives market in the
near future, remarks an FMI analyst.
Competitive
Landscape
Prominent
players in the Electronics Adhesives market are 3M, Dymax Corporation, DOW
Chemical Company, Henkel AG & Co. KGaA, H.B. Fuller Company (Royal
Adhesives & Sealants LLC), Evonik Industries AG, Sika AG, Bostik AG, ThreeBond,
Shin Etsu Silicones, Konishi Co, LTD., TERAOKA SEISAKUSHO CO., LTD., TOMOEGAWA,
and YAMATO Co., Ltd., among others.
Recent
Developments
- In 2021, B. Fuller announced
the development of a new generation of UV-curable adhesives for
electronics assembly. These adhesives offer rapid curing, high bond
strength, and enhanced environmental resistance, enabling efficient
production processes and improved product performance.
- In 2021, Henkel launched a
new series of electrically conductive adhesives (ECAs) for automotive
electronics applications. These adhesives provide reliable electrical
conductivity, excellent adhesion to various substrates, and resistance to
harsh automotive environments.
- In 2020, 3M launched a new
series of thermally conductive adhesives designed for bonding and
dissipating heat in electronic devices. These adhesives provide efficient
thermal management, enabling improved performance and reliability of
electronic components.
More
Valuable Insights Available
Future Market
Insights offers an unbiased analysis of the global electronics adhesives
market, providing historical data for 2018 to 2022 and forecast statistics
from 2023 to 2033.
To
understand opportunities in the electronics adhesives market, the market is segmented
on the basis of material type (polyurethane, acrylics, silicones, and epoxy),
by end-use (thermal management, conformal coatings, encapsulation, surface
mounting, wire tacking, soldering, underfills, sealing, and constructional), by
application (mobiles and telecommunication devices, desktops and networks,
televisions, home appliances, automotive electronics, aerospace electronics,
analytical & measurement instruments, and other industrial), across five
major regions (North America, Latin America, Europe, Asia Pacific, and Middle
East & Africa (MEA)).
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