Electronics Adhesives Market Projected to Hit USD 13.7 Billion by 2035 at 8.5% CAGR

The electronics adhesives market is poised for significant expansion from 2025 to 2035, driven by rising demand for compact electronic components, growth in consumer electronics, and the rapid adoption of electric vehicles (EVs). Valued at USD 5.5 billion in 2024, the market is expected to grow at a robust CAGR of 8.5%, reaching approximately USD 13.7 billion by 2035.

Rising demand for high-reliability adhesives in printed circuit boards (PCBs), surface mount technology (SMT), and semiconductor manufacturing further accelerates market expansion.

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Key Factors Driving Market Growth

  1. Rising Demand for Miniaturization – As electronic devices become smaller and more complex, high-precision adhesives are essential for bonding components efficiently without compromising performance.
  2. Advancements in 5G Technology – The deployment of 5G networks requires high-frequency circuits, boosting demand for thermally and electrically conductive adhesives.
  3. Surge in Automotive Electronics – With the rise of electric and autonomous vehicles, the need for durable and heat-resistant adhesives in sensors, control units, and battery management systems is increasing.
  4. Environmental Regulations and Sustainable Adhesives – Market players are focusing on eco-friendly and solvent-free adhesives, complying with stringent environmental regulations.
  5. Growing Investments in Semiconductor Packaging – The rapid expansion of the semiconductor industry is elevating the demand for adhesives that enhance thermal management and component reliability.

Key Takeaways

  • The electronics adhesives market is expanding rapidly, driven by advancements in 5G, automotive electronics, and miniaturization trends.
  • Increasing adoption of sustainable and eco-friendly adhesives is reshaping industry standards.
  • Demand for thermally and electrically conductive adhesives is rising in semiconductor packaging and PCB assembly.
  • Leading players like Henkel, 3M, and Dow are focusing on R&D to develop next-generation adhesive solutions.
  • Strategic collaborations and acquisitions are shaping the competitive landscape, enabling companies to strengthen their global presence.

Competitive Outlook

The electronics adhesives market is highly competitive, with leading companies investing in R&D to develop advanced formulations and expand production capacity. Key players include:

  • B. Fuller
  • 3M Company
  • Dow Inc.
  • Henkel AG & Co. KGaA
  • Permabond LLC
  • Bostic (An Arkema Company)
  • Master Bond Inc.
  • DELO Industrial Adhesives
  • Panacol-Elosol GmbH
  • Epoxy Technology Inc.
  • Cyber bond (H.B. Fuller)
  • Parker Hannifin Corporation
  • Shin-Etsu Chemical Co., Ltd.
  • Lord Corporation

Companies are actively engaging in mergers, acquisitions, and strategic partnerships to enhance their market footprint and accelerate product innovations.

Electronics Adhesives Market Segmentation

By Material Type:

  • Polyurethane
  • Acrylics
  • Silicones
  • Epoxy

By Application:

  • Thermal Management
  • Conformal Coatings
  • Encapsulation
  • Surface Mounting
  • Wire Tacking
  • Soldering
  • Underfills
  • Sealing
  • Constructional

 

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